Microelectronics Research Development Corporation
RHBD; Temporal LatchTM SEU Immune 90nm CMOS Structured ASIC
Electronic integrated circuits providing radiation hardening for digital logic architecture
Features 
  • Single-Layer-Configurable
  • IBM 9LP 90nm CMOS technology 
  • Temporal Latch Technology for SEU immunity
  • Hardness Estimate: TID > 1Mrad(Si), SEU < 1e-8 Errors/day, SEL > 75 MeV-cm2/mg (LET) 
  • Design-Hardened Fabric w/Distributed Dual-Port SRAM (Logic Cell w/Memory in Each Tile) 
  • Logic based on Hardened Adjustable Temporal Latch w/Delay Control -> SEU Immunity 
  • Design-Hardened PLL; Input Frequency: 10MHz to 125MHz 
  • Design-Hardened 1.25 Gbps LVDS Channels; Input Frequency: 75 MHz to 125 MHz 
  • Design-Hardened Configurable 8K X 8 SRAM Memory Blocks w/EDAC 
  • Design-Hardened Via-Configurable ROM 
  • Design-Hardened Via-Configurable IO 
  • Dual Voltage Supply; 1.2V core and 1.8V to 2.5V IO
Structured ASIC Benefits
  • Advantages over FPGA
  • Advantages over Custom ASIC
  • Superior to TTL/COTS
  • Low Development and Fabrication Costs
  • Reduced Design Development & Fabrication Time
  • "Trusted Capabilities"
  • Excellent Performance Characteristics

6 Different Die Configurations
Available for Customer Personalizations:

4 = ~3mm x ~3mm die

3 = ~5mm x ~5mm die (2 styles)

2 = ~7mm x ~7mm die (2 styles)

1 = ~10mm x ~10mm die
One-layer programmability delivers low-costs, reduced design hours and rapid cycle time.
ViASIC/Triad's ViaPath place and route software converts a VHDL/Verilog design into a Design-Hardened Structured ASIC.